Development of Thermal Image Processing Module Using Common Image Processor


KIPS Transactions on Computer and Communication Systems, Vol. 9, No. 1, pp. 1-8, Jan. 2020
https://doi.org/10.3745/KTCCS.2020.9.1.1, Full Text:
Keywords: thermal camera, Image Signal Processing, Common Image Processor, Thermal Image Signal Processing
Abstract

The thermal image device support image to detect infrared light from the object without light. It can use not only defence-related industry, but also civilian industry. This paper presents a new thermal image processing module using common image processor. The proposed module shows 10~20% performance improvement with normal mode and 50% performance improvement with sleep mode compared with the previously thermal image module based FPGA. and it guarantees high scalability according to modular system. In addition, the proposed module improves modulation and reuse, so it expect to have reduction of development period, low development cost. various application. In addition, it expect to have satisfaction of customer requirements, development design, development period, release date of product.


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Cite this article
[IEEE Style]
H. J. Hwan, C. J. Woo, K. B. Mee and L. J. Sung, "Development of Thermal Image Processing Module Using Common Image Processor," KIPS Transactions on Computer and Communication Systems, vol. 9, no. 1, pp. 1-8, 2020. DOI: https://doi.org/10.3745/KTCCS.2020.9.1.1.

[ACM Style]
Han Joon Hwan, Cha Jeong Woo, Kim Bo Mee, and Lim Jae Sung. 2020. Development of Thermal Image Processing Module Using Common Image Processor. KIPS Transactions on Computer and Communication Systems, 9, 1, (2020), 1-8. DOI: https://doi.org/10.3745/KTCCS.2020.9.1.1.